| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and a method for testing a semiconductor which allow shortening a test time of a semiconductor device to be tested and obviating degradation of a quality with shipment of the semiconductor device. SOLUTION: From a semiconductor wafer 20 divided into a plurality of regions are selected semiconductor chips formed in a predetermined number of the regions, and each of the semiconductor chips is tested on all of test items. In the selected semiconductor chip, when the test is completed on plural (A) I/O pins provided in each of the semiconductor chips, percent defectives are calculated for every test item and for every I/O pin. In the succeeding tests of the semiconductor chips, the tests are made only for a predetermined given number B (B<A) of I/O pins instead of covering all of the A I/O pins. COPYRIGHT: (C)2007,JPO&INPIT
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