| 摘要 |
PROBLEM TO BE SOLVED: To provide a plasma processing method for conducting desirable surface treatment without the occurrence of abnormal discharge such as arc discharge. SOLUTION: The plasma processing method is characterized in that first electrodes 11, 12, and second electrode 17 movable relatively to the first electrodes 11, 12 are provided, an object to be processed 13 is installed between the first electrodes 11, 12 and the second electrode 17, a solid dielectric material 15 is provided successively to at least the beginning end to be processed and the terminal to be processed of the object to be processed 13, processing gas is introduced between the first and the second electrodes 11, 12 and 17 while the first electrodes 11, 12 abutting on the entire surfaces of the object to be processed 13 and the solid dielectric material 15 respectively, voltage is applied across the first and the second electrodes 11, 12 and 17, and the object to be processed 13 is processed by the plasma discharge generated between the first and the second electrodes 11, 12 and 17 while moving the second electrode 17 relatively to the first electrodes 11, 12 and the object to be processed 13. COPYRIGHT: (C)2007,JPO&INPIT |
