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发明名称
Semiconductor package
摘要
A semiconductor package that includes a semiconductor die and a heat spreader thermally coupled to the semiconductor and disposed at least partially within the molded housing of the package.
申请公布号
US2007210438(A1)
申请公布日期
2007.09.13
申请号
US20070715226
申请日期
2007.03.07
申请人
发明人
BRIERE MICHAEL A.;CHEAH CHUAN;HU KUNZHONG
分类号
H01L23/48
主分类号
H01L23/48
代理机构
代理人
主权项
地址
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