| 摘要 |
A stack package is provided to embody miniaturization of a package by using a leadframe of a multi down-set. A leadframe consists of an inner lead(1a) and an outer lead wherein the inner lead is multi down-set in the leadframe. A first semiconductor chip(2) is flip-chip bonded as a face-down type to the surface of the leadframe. A second semiconductor chip(4) is attached as a face-up type to the surface of the first semiconductor type. The bonding pad of the second semiconductor chip is electrically connected to the leadframe by a bonding wire(5). The first semiconductor chip, the second semiconductor chip, the bonding wire and the inner lead are sealed by a sealing material(6) in a manner that exposes the bottom surface of the down-set inner lead and the top surface of the inner lead which is not down-set. The inner lead can be doubly down-set to have a lower step surface and an upper step surface. |
