发明名称 |
CURABLE ENCAPSULANT COMPOSITION AND METHOD FOR PREPARING IT |
摘要 |
<p>An encapsulant for encapsulating electronic components and a method of making and/or using the encapsulant may be provided. An electronic device that includes the encapsulant may be provided. The curable encapsulant composition may include a mixture of a functionalized polymer and at least one reactive monomer composition. The reactive monomer composition may include a reactive monomer component that may be a low temperature solid and may be present in an amount in the reactive monomer composition a range of greater than about 20 weight percent based on the total weight of reactive monomer composition. The mixture, at about low temperature, may be solid or tack-free, or both solid and tack-free.</p> |
申请公布号 |
EP1831285(A1) |
申请公布日期 |
2007.09.12 |
申请号 |
EP20050825750 |
申请日期 |
2005.11.14 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
VALLANCE, MICHAEL;CAMPBELL, JOHN;ZARNOCH, KENNETH;SUSARLA, PRAMEELA;DUFFEY, BRYAN;YEAGER, GARY;O'BRIEN, MICHAEL |
分类号 |
C08G65/48 |
主分类号 |
C08G65/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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