| 摘要 |
The present invention provides a mold for fine electroforming M having a simple structure. In order to improve the productivity of a metal product, an electrode portion can be arranged with a much higher density, and a metal thin film formed on the electrode portion can easily be peeled off. The present invention provides a manufacturing method for manufacturing the mold M with a higher accuracy and by an easier way. The mold for fine electroforming M has a conductive substrate 1 to function as a cathode during electroforming and insulation layer 2 having an opening 21 , which has a shape corresponding to a shape of a plane shape of the metal product P and is through to the conductive substrate 1 , and composed of an inorganic insulation material having a thickness T<SUB>2 </SUB>of not less than 10 nm and less than one-half the thickness T<SUB>1 </SUB>of the metal product P. The surface of the conductive substrate 1 exposed at the opening 21 is adapted to serve as the electrode portion. The manufacturing method of the mold M has steps of: forming an inorganic thin film 2 ' to grow into the insulation layer 2 in an area excluding an area, where resist film R is pattern-formed, on the surface of the conductive substrate 1 ; and removing the resist film R to form the opening 21.
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