发明名称 Semiconductor device and method of manufacturing the same
摘要 The present invention provides a method of increasing designing freedom of a position to form a capacitor, and increasing a capacitance value thereof. When forming a first contact, a tungsten plug for increasing a surface area of a lower electrode is formed in a contact interlayer film at a region where the capacitor is to be formed. Since the tungsten plug does not have to be formed right above the capacitor contact, a position to form the capacitor is not limited by a position where the capacitor contact is provided.
申请公布号 US7268380(B2) 申请公布日期 2007.09.11
申请号 US20040941950 申请日期 2004.09.16
申请人 NEC ELECTRONICS CORPORATION 发明人 INOUE TOMOKO
分类号 H01L21/768;H01L27/108;H01L21/02;H01L21/8242;H01L29/76;H01L29/94;H01L31/119 主分类号 H01L21/768
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