PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THEREOF

摘要

A printed circuit board and a manufacturing method thereof are provided to improve optical connection efficiency by allowing a clad to function as an insulation layer. A printed circuit board includes a clad(20), a wiring pattern(30), a core(25), and a solder resist(40). The clad(20) surrounds the core(20). The wiring pattern(30) transfers an electric signal in the printed circuit board. An optical signal is transferred through the core(20) which is embedded in the clad(20) and surrounded by the clad(20). The solder resist(40) is formed on one plane of the clad(20) as a sheath for preventing unintended connection caused by soldering when parts are mounted.