| 摘要 |
Provided is a substrate processing apparatus by which slip on a substrate is suppressed by preventing deformation of a supporting section. A substrate processing apparatus (10) is provided with a process chamber (45) for processing a substrate (54); a heater (46) for heating inside the process chamber (45); a support (30) for supporting the substrate (54) inside the process chamber (45); and a substrate transferring plate (32) for transferring the substrate (54) to the support (30). The support (30) is provided with a ring member (80) for supporting the outer circumference of the substrate (54), and a support main body (34) for supporting the ring member (80). Of the ring member (80), a portion, which is at least from the far side in the inserting direction of a substrate transfer plate (32) to a portion adjacent to such portion and supported by the support main body (34) and positions outside the substrate (54) when the substrate (54) is placed on the ring member (80), is formed thicker than other portions. |
