| 摘要 |
An improved air flow management has an air control device for blocking air from low impedance airflow pathways without high thermal components and directing the air flow initially at specific components with high thermal loading. Other components are cooled by the air as it passes from the high thermal loading component to exit from the unit. The air control device directs the air flow by locating and sizing apertures in the air control device based on the location and thermal load of the components on the printed circuit board. Accordingly, the unit can require less air flow through the unit and smaller or no heat sinks than conventional methods.
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