| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED package and a method of manufacturing the same. <P>SOLUTION: An LED package according to the present invention comprises: a package body in which a cavity is formed; a plurality of LED chips mounted on the cavity; wire electrically connected to at least one of the LED chips; and a plurality of lead frames formed in the package body, with at least one of them electrically connected to the LED chips or a plurality of wires. <P>COPYRIGHT: (C)2007,JPO&INPIT |
