| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed wiring board having a through-hole structure where a defect of a void and occurrence of crack are reduced, a connection failure of a substrate is reduced, and mechanical strength of the substrate is improved. <P>SOLUTION: The printed wiring board has a through-hole obtained by filling an open hole arranged in an insulating resin substrate with plating. Positions of centroid shafts are shifted and arranged in the respective through-holes exposed from a surface and a rear face of the insulating resin substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
