| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component having a resistive element capable of suppressing meltdown of solder in executing surface mounting and sufficiently forming a low melting point metal film such as solder on the surface of a heat radiating member. SOLUTION: An electronic component has a resistive element having surface terminal electrodes 3 to be paired and provided on end side regions of an insulating substrate 2, and a resistor 4 arranged on one surface of the insulating substrate 2 and connected to both the surface terminal electrodes 3; and a heat radiating member 9 arranged on the other surface of the insulating substrate 2 and used for heat radiation of the resistive element. The heat radiating member 9 is electrically connected to only one of the paired electrode terminals 3 via an electric connection portion 10 having a width dimension using a length of not more than 1/3 of the maximum value of a terminal electrode width in a direction along the surface of the insulating substrate 2 and orthogonal to the arrangement direction of the terminal electrodes 3. COPYRIGHT: (C)2007,JPO&INPIT
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