发明名称 |
PLATING METHOD AND APPARATUS FOR CYLINDER |
摘要 |
PROBLEM TO BE SOLVED: To provide a plating method and an apparatus for a cylinder by which the cylinder is plated with copper to have uniform thickness through the whole length without causing defects such as nibs or pits regardless of the size of the cylinder and thicker plating at the vicinity of both end parts of the cylinder than that on a drum part is remarkably suppressed and then, a post-treatment such as grinding to make the plating thickness uniform is dispensed with or simplified. SOLUTION: In the method of plating the cylinder by plating the outer circumferential surface of the long-sized cylinder with an insoluble electrode: the insoluble electrode is divided into many divided electrodes; the divided electrodes corresponding to the vicinity of both end parts in the longitudinal direction of the cylinder are separated into 3 divided electrode groups; each divided electrode group has one or more divided electrodes and the thickness of the outer circumferential surface of both end parts of the cylinder is adjusted by controlling the potential of the divided electrode groups. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2007224321(A) |
申请公布日期 |
2007.09.06 |
申请号 |
JP20060043333 |
申请日期 |
2006.02.21 |
申请人 |
THINK LABORATORY CO LTD |
发明人 |
SHIGETA TATSUO;INOUE MANABU;MATSUMOTO NORIKO |
分类号 |
C25D17/10;C25D7/00;C25D17/00;C25D21/12;C25D21/14 |
主分类号 |
C25D17/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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