发明名称 LAMINATED CHIP DEVICE AND METHOD OF MANUFACTURING THEREOF
摘要 A stacked chip device is provided to obtain the excellent attenuation characteristic of a filter by forming additionally a metal pad for forming a capacitor and an external electrode pattern on the upper surface of an element. A stacked chip device includes a first inner electrode connected to a first outer terminal(40) on a first lateral surface of an element, a second inner electrode pattern connected to a second outer terminal(42) on a second lateral surface of the element, and a third inner electrode pattern connected to a third outer terminal on a third lateral surface of the element. An electronic device pattern is formed on the upper surface of the element wherein one end of the electronic device pattern is connected to the first outer terminal and the other end of the electronic device pattern is connected to the second outer terminal. A ceramic sheet is stacked on the electronic device pattern. An outer electrode pattern(36) is formed on the upper surface of the ceramic sheet, connected to the third outer terminal. The electronic device pattern can be a resistor pattern(30a,30b) or an inductor pattern.
申请公布号 KR20070090677(A) 申请公布日期 2007.09.06
申请号 KR20060020663 申请日期 2006.03.03
申请人 AMOTECH CO., LTD. 发明人 RYU, JAE SU;LEE, SEUNG CHUL
分类号 H01L23/12;H01P1/20 主分类号 H01L23/12
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