发明名称 METHOD FOR CORRECTING DIE PICKUP POSITION
摘要 A method for correcting a position of a die pickup is provided to prevent a pickup error or bad bonding by detecting a fiducial mark of a die to be picked up at a die bonding device. A fiducial mark of a die is taught by a vision camera(S10), and teaching coordinates are compared with preset coordinates of the die to compute a variation(S30). The preset coordinates are corrected by adding or subtracting the variation to or from the preset coordinates, and the corrected preset coordinates are output. In the output step, the corrected preset coordinates are output to pick up the die by a pickup head, and the picked-up die is rotated by the variation.
申请公布号 KR20070090670(A) 申请公布日期 2007.09.06
申请号 KR20060020649 申请日期 2006.03.03
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 KIM, YOUNG HEON
分类号 H01L21/66;H01L21/60 主分类号 H01L21/66
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