| 摘要 |
PROBLEM TO BE SOLVED: To reduce Manhattan phenomenon in a printed circuit board with chip components or the like mounted thereon through soldering. SOLUTION: In order to solve the problem, the printed circuit board is equipped with a substrate 6, a pattern 7A provided on the substrate 6, another pattern 7B provided on the substrate 6, and a resist 8 provided so as to cover the upper surface of the substrate 6 and the patterns 7A, 7B. A component connecting unit 7AA in the pattern 7A and another component connecting unit 7BB in the pattern 7B are in parallel state substantially. In the printed circuit board, the resist 8 in the component connecting units 7AA, 7BB is provided with an opening unit 8A, substantially orthogonal to the component connecting units 7AA, 7BB and extended to the outside of the component connecting units 7AA, 7BB. COPYRIGHT: (C)2007,JPO&INPIT
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