发明名称 Cantilever microprobes for contacting electronic components and methods for making such probes
摘要 Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of two-part probe elements, socket-able probes and their mounts. Some embodiments are directed to methods for fabricating such probes and mounts. In some embodiments, for example, probes have slide in mounting structures, twist in mounting structures, mounting structures that include compliant elements, and the like.
申请公布号 US2007205374(A1) 申请公布日期 2007.09.06
申请号 US20060636147 申请日期 2006.12.07
申请人 MICROFABRICA INC. 发明人 CHEN RICHARD T.;ARAT VACIT;FOLK CHRIS;COHEN ADAM L.
分类号 G01K1/08;H01J3/14 主分类号 G01K1/08
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