Wafer treatment, involves coating front side of wafer with layer with separation properties and carrier layer, where carrier layer exhibits electrostatic properties and includes elastomer layer or hard layer of polyimide

摘要

Wafer treatment involves coating a front side of a wafer with a layer with separation properties and a carrier layer, where the carrier layer exhibits electrostatic properties. An elastomer layer (5) and a hard layer of polyimide (6) are provided in the carrier layer, where the elastomer layer and the hard layer are fixed by electrostatic surfaces and/or electrostatic devices. Multiple layers of the carrier layer are supported by a mixture of suitable materials or by the material selection of the electrostatic properties of the carrier layer.