| 摘要 |
PROBLEM TO BE SOLVED: To highly precisely estimate a failure cause of a semiconductor wafer. SOLUTION: A failure cause analysis method analyzes the failure cause of the semiconductor wafer provided with a plurality of semiconductor chips. The method includes a step (S100) for acquiring a two-dimensional luminance image by allowing a current to flow into a plurality of test patterns formed on the semiconductor wafer, a step (S104) for executing level determination for each test pattern on the basis of the two-dimensional luminance image, and steps (S110-S114) for judging whether the failure cause of the semiconductor wafer is either of a wiring formation failure and a via formation failure corresponding to a test pattern quantity made to correspond to each level. COPYRIGHT: (C)2007,JPO&INPIT
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