| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve durability and improve surface flatness on high level. <P>SOLUTION: A contactless IC card 1 equipped with parts including an IC module having an IC chip 2a and an antenna 2b, and filled with adhesive 6 and 7 has a heat radiation structure 200 near the IC chip 2a. An IC card manufacturing method for manufacturing the contactless IC card 1 equipped with parts including the IC module having the IC chip 2a and antenna 2b, and filled with the adhesive 6 and 7 comprises arranging the heat radiation structure 200 adjacent to the IC chip 2a and adhesive 6 and 7, driving the IC module, causing the heat radiation structure 200 to radiate heat generated by the IC module to soften the adjacent adhesive 6 and 7, and pressing the softened adhesive 6 and 7 by means of flat plates 201. <P>COPYRIGHT: (C)2007,JPO&INPIT |
