| 摘要 |
A method of fabricating a semiconductor device in which an external connection surface of a lead electrically connected to a semiconductor chip is exposed in a state where it is nearly flush with a surface of a package. The method includes a resin sealing step for integrally forming a sealing portion for sealing the semiconductor chip and a protective resin layer almost covering the external connection surface using a material for the package, and a resin removing step for removing at least a part of the protective resin layer, to expose the external connection surface. The resin removing step may be a grinding step for grinding the protective resin layer. <IMAGE> |
