Method of RFIC die-package configuration

摘要

A method for packaging a radio frequency integrated circuit (RFIC) in multiple packages begins by determining a 1^st position of the RFIC die in a 1^st package wherein the positioning is such to minimize adverse affects of parasitic components of coupling between the radio frequency input/output section and an antenna. Once the position within the 1^st package has been determined, the corresponding parasitics are measured to determine their values. The processing then continues by determining a 2^nd position of the RFIC die in a 2^nd package based on the values of the parasitic components. Accordingly, the 2^nd position places the die within the 2^nd package such that the parasitic components of coupling between the RF I/O section to the antenna within the 2^nd package substantially matches the parasitic components of coupling the RFIO section to the antenna in the 1^st package. Accordingly, different packages may be used with the same RFIC die, while maintaining the desired noise reduction.