发明名称 Design pattern correction method and mask pattern producing method
摘要 There is disclosed a method of correcting a design pattern considering a process margin between layers of a semiconductor integrated circuit, including calculating a first pattern shape corresponding to a processed pattern shape of a first layer based on a first design pattern, calculating a second pattern shape corresponding to a processed pattern shape of a second layer based on a second design pattern, calculating a third pattern shape using a Boolean operation between the first and second pattern shapes, determining whether or not an evaluation value obtained from the third pattern shape satisfies a predetermined value, and correcting at least one of the first and second design patterns if it is determined that the evaluation value does not satisfy the predetermined value.
申请公布号 US7266801(B2) 申请公布日期 2007.09.04
申请号 US20040012613 申请日期 2004.12.16
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 KOTANI TOSHIYA;KYOH SUIGEN;ICHIKAWA HIROTAKA
分类号 G03F1/08;G06F17/50;G03F1/36;G03F1/68;G03F1/70;H01L21/00;H01L21/027;H01L21/82 主分类号 G03F1/08
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