发明名称 |
Method for forming bump on electrode pad with use of double-layered film |
摘要 |
A process for forming bumps on electrode pads for a wiring board including a substrate and a plurality of electrode pads. The process (a) forms a laminated two-layer film on the wiring board and forms a pattern of apertures at positions corresponding to the electrode pads, the laminated two-layer film including a lower layer containing an alkali-soluble radiation-nonsensitive resin composition and an upper layer containing a negative radiation-sensitive resin composition; (b) fills a low-melting metal in the aperture pattern; (c) reflows the low-melting metal by pressing or heating to form bumps; and (d) peels and removes the laminated two-layer film from the board. The laminated film including two layers with different properties permits high resolution and easy peeling.
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申请公布号 |
US7265044(B2) |
申请公布日期 |
2007.09.04 |
申请号 |
US20050524510 |
申请日期 |
2005.02.14 |
申请人 |
JSR CORPORATION |
发明人 |
OHTA MASARU;INOMATA KATSUMI;IWANAGA SHINICHIRO |
分类号 |
G03F7/11;H01L21/44;G03F7/40;G03F7/42;H01L21/60;H01L23/12;H05K3/28;H05K3/34 |
主分类号 |
G03F7/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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