发明名称 |
Hybrid circuit substrate with optical and electrical interconnects, hybrid circuit module with optical and electrical interconnects and manufacturing methods thereof |
摘要 |
Transmission of electric and optical signal, realization of high-speed and high capacity of transmission of information signals. A base substrate section having an interconnect layer formed on an insulating substrate by a printed circuit process; a micro interconnect circuit section having a micro electrical interconnect layer which is finer than the interconnect layer of the base substrate section, formed on an insulating resin layer by a semiconductor process; and an optical interconnect circuit section adapted to transfer and/or receive an optical signal and provided with an optical wave-guide having an input section and an output section of a optical signal at opposite ends thereof; and at least a pair of optical elements composed of a light emitting device with a light emitting section thereof facing the input section and a photo detecting device with a photo detecting section thereof facing the output section are provided and the micro interconnect circuit section and the optical interconnect circuit section are mounted on the base substrate section.
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申请公布号 |
US7266262(B2) |
申请公布日期 |
2007.09.04 |
申请号 |
US20030691085 |
申请日期 |
2003.10.22 |
申请人 |
SONY CORPORATION |
发明人 |
OGAWA TSUYOSHI |
分类号 |
G02B6/12;G02B6/122;G02B6/42;G02B6/43;H01L25/16;H05K1/02;H05K1/18;H05K3/00;H05K3/46 |
主分类号 |
G02B6/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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