THERMOSETTING RESIN COMPOSITION, THERMOSETTING FILM, CURED PRODUCT OF THOSE, AND ELECTRONIC COMPONENT

摘要

Disclosed is a thermosetting resin composition containing an epoxy resin (A), a diene-based crosslinked rubber (B) wherein the amount of bonded acrylonitrile is less than 10% by weight, a curing agent (D) and/or a curing catalyst (E). A cured product obtained by curing such a thermosetting resin composition is excellent in electrical insulation, electrical characteristics and the like.