| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit module which allows checking for air bubbles between mount components and a circuit board after an insulating resin layer is filled, and thus makes it possible to reliably prevent shipment of defective products containing air bubbles. <P>SOLUTION: A chip element 31 is mounted on a mount electrode 29 via an outer electrode 35. At this time, a cut surface 41 of the chip element is arranged so that it can be oriented toward a side on the end where the mount electrode 29 of a circuit module 20 is formed. In addition, a gap 34 which is observable from outside of the circuit module is composed between a bottom surface of a base 33 of the chip element 31 and a top surface of a circuit board 21. <P>COPYRIGHT: (C)2012,JPO&INPIT |
