发明名称 LOW VOIDING NO FLOW FLUXING UNDERFILL FOR ELECTRONIC DEVICES
摘要 A no flow fluxing underfill having a hardener component comprising a phenolic component and an anhydride component in a molar ratio of phenolic component to anhydride component of between about 0.1:1 and about 2:1; or between about 0.8:1 and about 1.2:1. An underfill preparation method involving blending an epoxy component and a phenolic component, heating the blend, and cooling the blend, prior to incorporation of an anhydride component.
申请公布号 KR20070083541(A) 申请公布日期 2007.08.24
申请号 KR20077005244 申请日期 2007.03.05
申请人 FRY'S METALS, INC. 发明人 HURLEY JAMES M.;WILSON MARK;YE XIAOYUN
分类号 C08L61/10;C08L61/16;C08L63/00 主分类号 C08L61/10
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