Manufacturing method for light coupling device, involves placing waveguide layer on substrate so that orientation of main etching rate of inclination of wedge angle relates perpendicular to substrate surface

摘要

The method involves applying a mono-crystalline waveguide layer on a substrate and deformed by a lithography method for the adapter. The waveguide layer is placed on the substrate so that the orientation of the main etching rate of the inclination of the wedge angle relates perpendicular to the substrate surface. The waveguide layer is formed at the manifold with an etching removal in the orientation of the main etching rate. The waveguide layer has a crystal faces of single-crystal silicon.