| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of ashing with no residuals left without stressing an object to be processed, and to provide an ashing device. SOLUTION: A manufacturing method of a semiconductor device includes a processing step of forming a resist pattern on a surface of a substrate to be processed for carrying out predetermined processing using the resist pattern as a mask, and a resist peeling process for peeling off the resist pattern by ashing. It includes, prior to the ashing, a step of removing a surface layer or a surface modified layer deposited on the surface of the resist pattern by the processing step under a low temperature. COPYRIGHT: (C)2007,JPO&INPIT
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