| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board in which poor soldering of a conduction boss is avoided. SOLUTION: The printed circuit board 10 is composed so that the conduction boss 3 of a conductive member for introducing a current supplied from the outside is fixed to a through-hole 1 by flow soldering. The conduction boss 3 is penetratingly arranged to the through-hole 1 so as to regulate the movement in a direction vertical to an axial direction of the conduction boss 3. A through-hole 4 is formed at a plating processor 2, in which the periphery including the through-hole 1 is subjected to plating treatment, so as to raise molten solder from the through-hole 4 when executing the flow soldering. COPYRIGHT: (C)2007,JPO&INPIT
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