Electroless plating apparatus and plating solution

摘要

An electroless plating apparatus can suppress a change in quality of a plating solution and form a plated film without loss of its properties and reliability. The electroless plating apparatus includes a plating solution circulation system having a plating solution supply pipe for supplying a plating solution in a plating solution reservoir tank to a plating tank and a plating solution recovery pipe for returning the plating solution in the plating tank to the plating solution reservoir tank, and a heat retention section for preventing lowering of the temperature of the plating solution in the entire plating solution circulation system.