COMPOSITIONS AND METHODS FOR CMP OF INDIUM TIN OXIDE SURFACES

摘要

The present invention provides chemical-mechanical polishing (CMP) compositions and methods for polishing an ITO surface. The compositions of the invention comprise a particulate zirconium oxide or colloidal silica abrasive, which has a mean particle size of not more than 150 nm, suspended in an aqueous carrier, which preferably has a pH of not more than 5. Preferably, the abrasive has a surface area in the range of 40 to 220 m²/g. The CMP compositions of the invention provide an acceptably low surface roughness when used to polish an ITO surface, providing clean and uniform surfaces.