| 摘要 |
PROBLEM TO BE SOLVED: To downsize a piezoelectric device in which a piezoelectric vibration chip and a wire bonding type IC clement are stored in vertical arrangement. SOLUTION: This package container 10 has a recessed part provided so that an IC element packaging part P1 to which an IC element 20 is connected, and a piezoelectric vibration chip packaging part P2 to which a crystal vibration chip 30 is connected are vertically arranged. The IC element packaging part P1 has the rectangular shape by plain view, is equipped with a plurality of lead electrodes 12a-12h for connecting the IC element 20 fixed to the bottom of the recessed part by wire bonding, and the piezoelectric vibration chip packaging part P2 has mount electrodes 13a, 13b for joining the crystal vibration chip 30. The plurality of lead electrodes 12a-12h are provided near corner parts of the IC element packaging part P1, respectively. COPYRIGHT: (C)2007,JPO&INPIT
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