| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a part containing printed wiring board in which voids are not generated in resin for embedding chips, even when a solder resist is formed in the mounting land of an inner layer. <P>SOLUTION: In the printed wiring board containing the chips, the solder resist to be formed in the mounting land of the chips is formed so as to cover the periphery of the mounting land, and a part where solder resist is not formed is provided between the adjacent mounting lands. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
