| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device wherein damages to a lower-side semiconductor chip can be reduced as much as possible even if a foreign matter is bitten between two semiconductor chips when mounting these semiconductor chips on a multi-chip package having a chip stack structure. <P>SOLUTION: The semiconductor device has such a structure that the two semiconductor chips 20 and 40 are stacked on a chip mounting portion 10 via a die mount material 30. Bonding wires 60 are connected to these semiconductor chips 20 and 40. On a plane of the lower-side chip 20 which is in contact with the die mount material 30, a protection film 21 whose elastic modulus at the temperature of connecting the bonding wire 60 to the upper-side chip 40 is 100 MPa or above is formed. The protection film 21 consists of two layers 21a and 21b which are stacked, and the total thickness (t1+t2+t3) of the protection film 21 and the die mount material 30 is 20μm or above. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
