Flip-Chip mit wärmeleitender Schicht

摘要

A flip-chip integrated circuit having passive 302, 304, 306 as well as active 308, 310 components on a surface of a substrate. A heat conductive layer (313) is formed over the active component (308) for conducting heat away from the active component to a heat dissipating layer (314). A dielectric layer (322) is formed over the passive component (310) (preferably a transmission line) such that the surface of the dielectric layer (322) is substantially planar with the conductive layer (313). <IMAGE>