SEMICONDUCTOR PACKAGE COMPRISING LEAD STRUCTURE FOR IMPROVING WHISKER

摘要

A semiconductor package is provided to improve the solder-wettability and to restrain the generation of whisker by reducing the area of a mounting portion using a tilted surface of an upper side of the mount portion. A semiconductor package includes a package body(110) with an embedded semiconductor chip and a plurality of leads. The plurality of leads(120) are connected with the semiconductor chip and protruded to the outside from the package body. The lead is composed of a shoulder portion(121) protruded from a side of the package body, a stepped portion(123) formed from the shoulder portion downward, and a mount portion. The mount portion(125) is connected with the stepped portion and stretched to the outside of the package body. The mount portion has a tilted surface(128) at an upper side.