SEMICONDUCTOR CHIP AND MANUFACTURING METHOD AND MOUNTING STRUCTURE THEROF

摘要

A semiconductor chip, its fabricating method and a mounting structure of the same are provided to reduce a mounting height of the chip by positioning a given portion of a solder bump in the chip. A semiconductor chip includes plural chip active regions formed with an integrated circuit, and a scribe lane region formed on an outside of the chip active region. Bonding pads(13) are formed over the chip active region which is connected to the integrated circuit and is outwardly exposed, and the scribe lane region. A bump is filled in a hole(17) which vertically penetrates the bonding pad of the scribe lane region, and protrudes from at least one surface of upper and lower surfaces of the chip.