| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a piezoelectric oscillator capable of simplifying a manufacturing process by changing a solder flux process for adhering solder flux to a solder bump of a semiconductor circuit element in the manufacturing process of the piezoelectric oscillator. SOLUTION: The manufacturing method comprises steps of: applying the solder flux 14 to a wafer-like silicon substrate 31 in which a plurality of semiconductor circuit elements 7 are formed, each of the semiconductor circuit elements 7 is provided with a mounting electrode 19, and the mounting electrode 19 has a solder bump 12, and forming a film layer of the solder flux 14 covering the solder bumps 12; dividing the wafer-like silicon substrate 31 with the film layer of the solder flux 14 processed and obtaining each of the semiconductor circuit elements; and mounting the semiconductor circuit elements 7 on a substrate of a first container 20 and heating, making conductive and adhering the semiconductor circuit elements 7. The piezoelectric oscillator is composed of a piezoelectric vibrator 5 comprising a second container 1 of an airtight structure. COPYRIGHT: (C)2007,JPO&INPIT
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