发明名称 APPARATUS FOR CONTROLLING SUBSTRATE PROCESSING APPARATUS AND PROGRAM FOR CONTROLLING SUBSTRATE PROCESSING APPARATUS
摘要 <p>[PROBLEMS] To provide a control apparatus for flexibly controlling a substrate processing apparatus corresponding to product process. [MEANS FOR SOLVING PROBLEMS] Four process recipes (PM1-PM4) are stored in a first storage section (255a), and pre-recipes for high temperature, medium temperature and low temperature are stored in a second storage section (255b) by being associated with each process recipe. A process recipe specifying section (260) corresponds to recipe specification by an operator and specifies a process recipe which corresponds to the specified recipe from the first storage section (255a). A stage temperature acquiring section (265) acquires a stage temperature from the specified process recipe. A pre-recipe selecting section (270) selects one pre-recipe which corresponds to the stage temperature, from among the three kinds of pre-recipes stored in the second storage section (255b). As a result, the substrate processing apparatus (PM: process module) can be maintained in an excellent status according to the selected pre-recipe, prior to forming a film on a wafer (W).</p>
申请公布号 WO2007091555(A1) 申请公布日期 2007.08.16
申请号 WO2007JP52021 申请日期 2007.02.06
申请人 TOKYO ELECTRON LIMITED;MORISAWA, DAISUKE;HIROSE, MASAYUKI 发明人 MORISAWA, DAISUKE;HIROSE, MASAYUKI
分类号 H01L21/02;C23C16/52;H01L21/205;H01L21/285 主分类号 H01L21/02
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