发明名称 |
APPARATUS FOR CONTROLLING SUBSTRATE PROCESSING APPARATUS AND PROGRAM FOR CONTROLLING SUBSTRATE PROCESSING APPARATUS |
摘要 |
<p>[PROBLEMS] To provide a control apparatus for flexibly controlling a substrate processing apparatus corresponding to product process. [MEANS FOR SOLVING PROBLEMS] Four process recipes (PM1-PM4) are stored in a first storage section (255a), and pre-recipes for high temperature, medium temperature and low temperature are stored in a second storage section (255b) by being associated with each process recipe. A process recipe specifying section (260) corresponds to recipe specification by an operator and specifies a process recipe which corresponds to the specified recipe from the first storage section (255a). A stage temperature acquiring section (265) acquires a stage temperature from the specified process recipe. A pre-recipe selecting section (270) selects one pre-recipe which corresponds to the stage temperature, from among the three kinds of pre-recipes stored in the second storage section (255b). As a result, the substrate processing apparatus (PM: process module) can be maintained in an excellent status according to the selected pre-recipe, prior to forming a film on a wafer (W).</p> |
申请公布号 |
WO2007091555(A1) |
申请公布日期 |
2007.08.16 |
申请号 |
WO2007JP52021 |
申请日期 |
2007.02.06 |
申请人 |
TOKYO ELECTRON LIMITED;MORISAWA, DAISUKE;HIROSE, MASAYUKI |
发明人 |
MORISAWA, DAISUKE;HIROSE, MASAYUKI |
分类号 |
H01L21/02;C23C16/52;H01L21/205;H01L21/285 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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