| 摘要 |
The polishing pad ( 104 ) is useful for polishing at least one of magnetic, optical and semiconductor substrates ( 112 ) in the presence of a polishing medium ( 120 ). The polishing pad ( 104 ) includes a three-dimensional network of interconnected unit cells ( 225 ). The interconnected unit cells ( 225 ) are reticulated for allowing fluid flow and removal of polishing debris. A plurality of polishing elements ( 208 ) form the three-dimensional network of interconnected unit cells ( 225 ). The polishing elements ( 208 ) have a mean height ( 214 ) to a mean width ( 222 ) ratio of at least 3. The polishing surface ( 200 ) formed from the plurality of polishing elements ( 208 ) remains consistent for multiple polishing operations.
|
