| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of fabricating a solid interconnection which allows the formation of solid interconnection electrodes in a fine pitch, and has an excellent connection reliability. SOLUTION: This manufacturing method of solid interconnections fabricates a first interconnection electrode group 30 in a plurality of stages, and a second interconnection electrode 40 for connecting the first interconnection electrode group 30 at least in the height direction by stereolithography. The method comprises a process of carrying out batch exposure in a predetermined pattern formed in a mask 150 and in a predetermined thickness, to form the first interconnection electrode group 30 and the second interconnection electrode 40 sequentially in the height direction; and a process of forming an insulation layer to bury the first interconnection electrode group 30 and the second interconnection electrode 40 in. COPYRIGHT: (C)2007,JPO&INPIT |
