| 摘要 |
The present invention generally provides an apparatus and method for selectively forming a metallized feature, such as an electrical interconnect feature, on a electrically insulating surface of a substrate. The present invention also provides a method of forming a mechanically robust, adherent, oxidation resistant conductive layer selectively over either a defined pattern or as a conformal blanket film. Embodiments of the invention also generally provide a new chemistry, process, and apparatus to provide discrete or blanket electrochemically or electrolessly platable ruthenium or ruthenium dioxide containing adhesion and initiation layers. In general, aspects of the present invention can be used for flat panel display processing, semiconductor processing, solar cell device processing, or any other substrate processing, being particularly well suited for the application of stable adherent coating on glass as well as flexible plastic substrates. This invention may be especially useful for the formation of electrical interconnects on the surface of flat panel display or solar cell type substrates where the line sizes are generally larger than semiconductor devices or where the formed feature are not generally as dense. |
