| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a WLCSP structure which includes an electrode on a side surface, while keeping a chip size minimally required for forming an integrated circuit, and is easily manufactured. <P>SOLUTION: A substrate 2 being smaller in outer shape than a semiconductor chip 1 is made to adhere on the main surface of the semiconductor chip 1. The electrode 8 for external connection to be electrically connected to the electrode of the semiconductor chip 1 is arranged on the side surface of the substrate 2. The electrode 8 for external connection is formed so as to allow one side surface 8a of the electrode 8 for external connection to be the same surface as the side surface of the semiconductor chip 1. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
