| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide laser processing method and a laser processing system in which a protective tape to which a workpiece such as a wafer is stuck can be prevented from adhering to a chuck table even if the tape is fused. <P>SOLUTION: The laser processing method employs a laser processing system comprising a chuck table for holding a workpiece, and a means for irradiating the workpiece held on the chuck table with a laser beam. The laser processing of the workpiece is peroformed in a state that the workpiece is stuck to a protective tape by mounting the protective tape side on the chuck table, irradiating the workpiece with the laser beam from a laser beam irradiation means, and interposing a wetting member between the chuck table 4 and the protective tape 12. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
