| 摘要 |
PROBLEM TO BE SOLVED: To provide a sheet pasting apparatus and pasting method in which the inside of the device can be cleaned by enabling a robot which operates a cutter blade as predetermined, to take a cleaning member while switching it. SOLUTION: A sheet S is fed from a pasting unit 12 onto an upper face of a table 11 supporting a semiconductor wafer W, and the relevant sheet S is pasted on an upper face of the semiconductor wafer W. As the sheet S, a sheet sized to be protruded from the semiconductor wafer W is used and after being pasted, the sheet is cut in accordance with a shape of the semiconductor wafer W by a cutter blade 43 mounted at a free end side of a multi-joint robot 14 which is numerically controlled. The robot 14 is capable of switching the cutter blade 43 to a cleaning member 63 and taking it and this cleaning member 63 is moved along with a preset orbit, so that a foreign substance or dust on or around the table 11 with the cutting is cleaned and can be prevented from being mixed between the semiconductor wafer W and the sheet S. COPYRIGHT: (C)2007,JPO&INPIT |
