| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a piezoelectric oscillator capable of simplifying manufacturing steps, by revising the solder coating step for electrical connection between a semiconductor component 7 and a first package 20, and to provide a structure of the piezoelectric oscillator. SOLUTION: The manufacturing method of the piezoelectric oscillator, configured by mounting the semiconductor component 7 into the first package 20 with a recessed opening and mounting a piezoelectric resonator 5 housed in a sealed package above the first package 20 in the manufacturing method steps of the piezoelectric oscillator, includes the steps of placing a mask 30 for covering the inner wall of an opening of the first package 20 and with a hole for exposing a pad region 14 as a whole, whereon the semiconductor component 7 is mounted onto the opening of the first package 20; removing the mask 30, after coating a solder 11 via the mask 30; fixing the semiconductor component 7 by heating; and carrying out continuity and jointing between respective first and second packages 20, 1. COPYRIGHT: (C)2007,JPO&INPIT
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