| 摘要 |
PROBLEM TO BE SOLVED: To provide an air-cooled cooler which makes the cooling ability of a portion bearing a semiconductor device generating less heat different from the cooling ability of a portion bearing a semiconductor device generating greater heat to improve the cooling ability of the portion bearing a semiconductor device generating greater heat. SOLUTION: Heat generating bodies placed on one surface of a board of the cooler are sorted into heat generating bodies that generate greater heat and heat generating bodies that generate less heat. The heat generating bodies generating less heat are located at the cooling wind inflow side of the board, while the heat generating bodies generating greater heat are located at the cooling wind outflow side of the board. A plurality of cooling fins disposed on the other surface of the board of the cooler are so arranged in adjacent rows that the intervals between the rows are wider at the cooling wind inflow side and narrower at the cooling wind outflow side. COPYRIGHT: (C)2007,JPO&INPIT |
